Standards & Publications
About IPC
IPC was founded in the USA in 1957 as Institute of Printed Circuits by PCB manufacturers. As more assembly companies joined to the association the name was changed. The well known initials, IPC were kept, but the current name is Association Connecting Electronics Industries.
Now IPC is a global trade association committed to networking and technical exchange. IPC is a voluntary organization furthering technical improvements, competitiveness, and financial succes of the members. More information can be found on IPC website.
About Standards
Creating standards is one of the most important activities of IPC. Standards are used world wide by not only the IPC members, but almost all companies of electronics industries. Standards provide common "language", equal understanding of phenomenon, expectations and criteria.
Why to use IPC Standards?
As a supplier of electronics industry we face day by day how big efforts are needed to comply with customers' requirements. The system of IPC Standards has been worked out by the players of electronics industries to make easier their own job. The Standards cover the complete manufacturing chain from the design to assembly. What benefits can you expect, if you use the systems of Standards and Trainings? It will
- improve the quality of your products,
- increase efficiency of your production,
- make easier to communicate with your customer and supplier,
- increase your competitiveness.
What else do you want?
IPC Standards are used globally. Anywhere you buy from, or supply to, the electronic assemblies, the applied materials and processes should be comply with the same requirements.
Nowadays we are challenged by accelerated changing of technology. Higher integrated components on smaller footprint, finer pitches, higher sensitivity, thicker and bigger boards, embedded components - to mention only a few of them.
You can find basics in printed literature, but not these. IPC's guidelines and handbooks provide updated instructions how to implement them in your processes. You can get the experiences of technology leaders of the world collected in clear system. Just utilize it! Or do you think, it is needed for your competitors only?
Click to the picture to download the IPC Publication Catalog.
Recommended new releases
IPC J-STD-001F Requirements of Soldered Electrical and Electronic Assemblies
IPC J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Examples of some of the significant changes are revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Whenever possible, the criteria descriptions have been adjusted to make them easier to understand for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610F and is supported by IPC-HDBK-001. 70 pages. Released July 2014.
IPC-A-610F Acceptability of electronic assemblies
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This revision includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding — all without eliminating any requirements.
Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria for through hole, SMT, cleaning, marking, coating and laminate requirements.
IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision F has 814 photos and illustrations of acceptability criteria — 86 of them new or updated. The document synchronizes to the requirements expressed in other industry consensus documents and is most often used with the material and process standard IPC J-STD-001. 424 pages. Released July 2014.
IPC-J-STD-030A Selection and Application of Board Level Underfill Materials
This document provides users of underfill material with guidance in selecting and evaluating underfill material for assembly solder joints second-level interconnects. Underfill material is used to increase reliability of electronic devices by two methods: alleviate coefficient of thermal expansion (CTE) mismatch (between the electronic package and the assembly substrate) and/or increase mechanical strength. Underfill materials are also used for environmental protection, mechanical shock or vibration, and anti-tampering uses. Materials used in underfill applications should not adversely affect device reliability nor degrade electrical performance (e.g., ionic impurities). When correctly selected and applied, underfill material should increase the life of the assembly solder joints. In addition, Revision A contains acceptability criteria for underfill on completed assemblies. 32 pages. Released March 2014.
IPC-A-630 Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
This standard is the first of its kind for IPC; the first acceptability standard for electronic enclosures. It contains acceptability criteria that pertain to the "box build" of the assembly process. This standard has been written to direct manufacturers and end users of electronic enclosures of electrical and electronic equipment to understand the best practices to meet requirements, ensuring the reliability and function of the end-item assembly for its intended design life. Released September 2013; 30 pages.
IPC-J-STD-003C Solderability Tests for Printed Boards
J-STD-003C prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands and plated-through holes utilizing either tin-lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of printed board surface conductors, attachment lands and plated-through holes to wet easily with solder and to withstand the rigors of the printed board assembly processes. This standard describes test methods by which both surface conductors (and attachment lands) and plated-through holes may be evaluated for solderability. Revision "C" contains the latest information about gauge repeatability and reproducibility (GR&R) of solderability tests as well as updated illustrations. Released October 2013; 27 pages.
IPC-HDBK-830A Guidelines for Design, Selection, and Application of Conformal Coatings
This handbook is a compilation of the conformal coating industry's practical experience, and will assist the designers and users of conformal coatings in making informed choices. Users will better understand the properties of the various conformal coatings, the results to be achieved by its application and how to verify that these goals have been met. Use this document as a supplement in conjunction with the industry standard for qualification and quality conformance of conformal coating, IPC-CC-830B. Revision "A" significantly updates the environmental, health, and safety information when dealing with conformal coatings including advice on use of Web-based MSDS reporting. Use of conformal coating for tin whisker and fungus mitigation is also discussed as well as flammability issues. Content of the standard includes the very latest from industry experts on the application and selection of conformal coatings. Released October 2013; 183 pages.
IPC-J-STD-006C Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ‘‘special’’ electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32. This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials to be used in the electronics industry. The other two standards in this set are IPC/EIA J-STD-004, Requirements for Soldering Fluxes, and IPC/EIA J-STD-005, Requirements for Soldering Pastes. This "C" revision has been updated to address intentional additions to a solder alloy and impurities in the alloy. In addition, the tables and appendices have been updated with the latest alloy information. 22 pages. Released July 2013.
IPC-5703 Cleanliness Guidelines for Printed Board Fabricators
Printed board cleanliness has historically been an unknown factor in the quality assessment of unpopulated (bare) printed boards; this has often been attributed to a lack of understanding of materials and processes. This document addresses the various printed board fabrication processes and how each may impact, directly or indirectly, the final cleanliness of packaged bare printed boards and ultimately printed board quality. 30 pages. Released May 2013.
IPC-9592B Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
This document standardizes the requirements for power conversion devices (PCDs) for the computer and telecommunications industries. The phrase “power conversion devices” refers to ac to dc and dc to dc modules, converters and power supplies. This specification sets the requirements for design; qualification testing; conformance testing and manufacturing quality/reliability processes, but does not include the functional requirements of the specific equipment. PCDs addressed in this document are used in the electronics industry to provide conversion of main power sources, usually ac to lower dc voltages for direct use of electronic circuits or as a secondary source for additional dc to dc PCDs to provide several dc voltage levels for various electronic devices in a product. Revision B of this document includes updated performance evaluations, including thermal and vibration; temperature, humidity and bias; temperature cycling; shock and vibration; random vibration and free-fall drop and shock tests. Additionally, nearly all of the device (component) derating guidelines were updated, including capacitors, resistors, diodes, transistors, transformers, inductors, microcircuits, circuit breakers, fuses, relays, switches and oscillators. The revision also provides more current and correct definitions for reliability terms, including the mean time between failure or MTBF. 126 pages. Released January 2013.
